Embedded Forum at electronica

November 13-16, 2018 @ Hall B5 - Stand 239

The Embedded Forum at electronica in Hall B5, Stand 239, is a theater-style presentation area with free access for all electronica visitors.

Aspencore is staging a 4-day forum program consisting of panel discussions and technical presentations about technologies, trends and product innovations covering the whole range of embedded technologies from Chips & Components over Tools & Software to Boards & Modules.

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Conference Program

Time Tuesday Wednesday Thursday Friday
10:00 Special Report: High-level programming
Aspencore>
10:30 Special Report: Addressing the growth in AI
Aspencore
Using Samsung ARTIK to create a smart, connected speaker
Samsung
11:00 Samsung ARTIK IoT Platform overview
Samsung
Using Samsung ARTIK IoT platform to enhance your application
Samsung
Special Report: Industry 4.0
Aspencore
11:30 Ultra-Low-Power DRAM: A “Green” Memory in IoT devices
Winbond
Industrial Internet of things
Winbond
Safeguarding Your Personal Digital Data with Winbond TrustME Secure Flash
Winbond
12:00 Mind of The Engineer
Aspencore Media
Arrow Development Tools and Production-ready Solution Platforms
Arrow Europe
Mind of The Engineer
Aspencore Media
12:30 Embedded HMIs and Panel PCs “Made in Germany”
Garz & Fricke
Mind of The Engineer
Aspencore Media
Open Standards for Embedded Computing
Presented by SGET
13:00 Special Report: Industry 4.0
Aspencore
Panel Discussion: Edge or cloud: what’s the right approach for Industry 4.0?
Aspencore
13:30 Make your IoT computing efficient and secure
KONTRON
Development of embedded system in China
Aspencore
14:00 How 1.2V Ultra-Low-Voltage Flash and High Speed Flash Optimize the Edge Node Performance
Winbond
Pushing Valuable Assets to The Limit With Industrial IoT
DFI
Panel Discussion: Addressing new opportunities enabled by 5G
Aspencore
14:30 Condition-Based Monitoring for Industrial Automation
Analog Devices
Securing your IoT with Winbond Flash Solutions
Winbond
15:00 Arrow’s end-to-end security technology stack
Arrow Europe
How to secure cloud connected IoT devices – A practical approach
Infineon
15:30 Innovation by integration - smart motor control
Infineon
Arrow IoT Solutions – From Sensor to Sunset
Arrow Europe
The edge is getting smarter: AI in the IoT driven by Arrow
Arrow Europe
16:00 Panel Discussion: Are open architectures the way forward?
Aspencore
Samsung ARTIK IoT Platform Überblick (German)
Samsung
Sustainable success through RFID innovation
ELATEC
16:30
17:00 Mind of The Engineer
Aspencore Media

Program Details

Time Lecture
13:00 Special Report: Industry 4.0
Nitin Dahad, Aspencore
With more and more awareness of the benefits of IoT, this report will look at the key players and platforms enabling more connected devices in industrial control systems and infrastructure, plus a special look at the all-important security aspects.
13:30 Make your IoT computing efficient and secure
Martin Unverdorben, Product Manager for Computer-on-Modules, KONTRON
Cloud, Edge and Fog computing is everywhere and everybody is talking about it. In industrial surroundings traditional server approaches cannot provide the required robustness for operation in harsh industrial environments. Several Computer-on-Modules concepts can help here to provide the regarding durability and robustness for different approaches in an inhomogeneous network.
14:00 How 1.2V Ultra-Low-Voltage Flash and High Speed Flash Optimize the Edge Node Performance
William Chen, Flash Memory Product Marketing Deputy Director, Winbond
As the Flash market prepares to standardize on new low-voltage ICs and dedicated to pursuing higher speed for automotive multiple display feature, Winbond has demostrated the feasibility of producing flash ICs operate from supply voltage as low as 1.2V and acheive high performance serial NAND fast speed 83MB/s and 166MB/s on a dual quad.
14:30 Condition-Based Monitoring for Industrial Automation
Pete Sopcik, Analog Devices
Condition-based monitoring in the industrial space is expanding beyond the most critical machinery on the factory floor due in part to next-generation technologies that provide high performance in smaller, mechanically optimized solutions. Breakthroughs in MEMS sensors, evolving communication requirements, optimized signal chains and processing techniques as well as insights into mechanical design and packaging enable real-time monitoring of equipment and enable advanced diagnostic and predictive applications. During this session we will introduce the various technologies that enable next-generation condition-based monitoring solutions and review some of the design considerations and performance requirements necessary to optimize these solutions for industrial applications.
15:00 Arrow’s end-to-end security technology stack
Hector Tejero, Arrow Europe
Arrow Security from Sensor to Sunset can help your business secure and manage your IoT devices throughout their lifecycle.Wether your company designs IoT devices or you just use IoT to benefit your business, Arrow’s end-to-end security technology stack can help you to achieve the security solution for your use case.
15:30 Innovation by integration - smart motor control
Christian Daniel, Infineon
Today’s inverterized motor control systems in Small and Major Home Appliances must fulfill a growing list of technical demands. Stable and smooth motor starting, low acoustic noise, wide range of operating speeds and vibration suppressing are just few of them. New energy efficiency regulations also require reconsidering of concepts how today’s motor & PFC implementations are done. At the same time system cost reductions and time to market reductions are still one of key challenges companies are confronted with.
16:00 Panel Discussion: Are open architectures the way forward?
Moderated by Aspencore
With open architectures (like RISC-V) now being more widely adopted, will this be the driver to open up the market for more flexibility and versatility in hardware designs to address rapid device deployment needs and lower volume production runs needed to serve mass personalization?
17:00 Mind of The Engineer
Rich Quinnell, Editor, Aspencore Media
Aspencore regularly surveys its worldwide engineering audience, seeking to understand “The Mind of the Engineer.” Questions cover work conditions, job satisfaction, information-gathering methods, and a host of other details to gain insights into how design engineering is being practiced across the globe, and exploring the regional and generational variations. Aspencore Special Projects Editor Rich Quinnell will be presenting the highlights of the 2018 survey results in a 20-minute session open to all Electronica attendees.
Time Lecture
10:30 Special Report: Addressing the growth in AI
Nitin Dahad, Aspencore
The explosive growth in machine learning applications and more demand likely from all kinds of industry verticals, we’ll take a look at some of the chips, technologies and architectures aiming to address the need, plus some of the work being done on new architectures being developed to overcome current bottlenecks in performance or capability.
11:00 Samsung ARTIK IoT Platform overview
Ashish Sethi, Samsung ARTIK EMEA
The ARTIK IoT Platform makes it easy for developers to create connected IoT solutions and intelligent solutions on the edge. We will show you how our platform takes away the inherent difficulties of connectivity, security, and edge analytics and allows you to focus on making great connected, intelligent, and secure IoT products.
11:30 Ultra-Low-Power DRAM: A “Green” Memory in IoT devices
Derek Lin, DRAM Product Marketing Department Manager, Winbond
The duty cycle of the current processors is typically characterised by long periods of very low levels of activity, as the operating system and radio devices tick over in the background, punctuated by short bursts of intense activity. The same pattern may be observed in the low-power DRAM main memory. Now Winbond is offering a way to extend the power savings available from Partial Array Self-Refresh (PASR), which was already specified in the JEDEC standard by implementing a new Deep Self-Refresh (DSR) mode.
12:00 Mind of The Engineer
Rich Quinnell, Editor, Aspencore Media
Aspencore regularly surveys its worldwide engineering audience, seeking to understand “The Mind of the Engineer.” Questions cover work conditions, job satisfaction, information-gathering methods, and a host of other details to gain insights into how design engineering is being practiced across the globe, and exploring the regional and generational variations. Aspencore Special Projects Editor Rich Quinnell will be presenting the highlights of the 2018 survey results in a 20-minute session open to all Electronica attendees.
12:30 Embedded HMIs and Panel PCs “Made in Germany”
Christoph Kutzera, Key Account Management - Custom Solutions, Garz & Fricke
G&F offers a wide range of highly modular and scalable embedded HMI platforms and Panel-PCs. We focus on the key aspects of sophisticated integration and customization for OEMs on the base of proven concepts and system architecture for applications in many different vertical markets. What does a successful project require? Individual consulting, close cooperation with our customers and monitoring, so that they can benefit from our longtime experience e.g. in development, design, mechanical adaption, touch-controller programming and cover glass selection, including the matching GUI tools and stacks too. Last but not least our in-house-manufacturing guarantees highest quality “Made in Germany”.
13:00 Panel Discussion: Edge or cloud: what’s the right approach for Industrie 4.0?
Moderated by Aspencore
With more and more concerns about security, plus the need to put more intelligence at the edge, how do you strike the right balance between putting your resources at the edge and in the cloud?
14:00 Pushing Valuable Assets to The Limit With Industrial IoT
Steven Wu, Vice President, DFI
In the past, the engineers passively understood the status of the production equipment. By leveraging the large amount of data from industrial IoT applications, condition-based maintenance has gradually shifted to predictive maintenance strategies, letting users be able to initiatively optimize maintenance processes and boost up production capacity.
14:30 Securing your IoT with Winbond Flash Solutions
Jackson Huang, Flash Memory Senior Marketing Director, Winbond
How secure is your IoT design? Can your boot code be changed? This session explores different security hacks against your IoT design and recommends appropriate Winbond solutions to defend against these threats. The session discusses flash with sectors and blocks that can be protected from program/erase, flash with multi-layer authentication capability for different layers in the chain of trust, and flash that can be uniquely paired with the chipset with all communications encrypted and signed and is immuned to physical attacks.
15:00 How to secure cloud connected IoT devices – A practical approach
Dr. Josef Haid, Infineon
How to secure cloud connected IoT devices – A practical approach.
15:30 Arrow IoT Solutions – From Sensor to Sunset
Andrew Bickley, Arrow Europe
Arrow’s Distribution capabilities now extend to support customers with complete Technology Platforms and Solutions. By aggregating electronics and enterprise computing solutions, Arrow is enabling customers from ideation through the complete technology stack, creating optimized designs capable of scaling for mass-production and full deployment.Complex designs are supported by Arrow in-house engineering services and system integration. Our design competence helps customers address big business challenges and create easy to use and easy to deploy solutions.
16:00 Samsung ARTIK IoT Platform Überblick (German)
Tom Van Den Bussche, Samsung ARTIK EMEA
Die ARTIK IoT-Plattform erleichtert es Entwicklern, vernetzte IoT- und Edge-Lösungen zu erstellen. Wir zeigen Ihnen, wie unsere Plattform die mit Konnektivität, Sicherheit und Edge Analytics verbundenen Schwierigkeiten beseitigt und Ihnen ermöglicht, sich auf die Herstellung von großartigen, intelligenten und sicheren IoT-Produkten zu konzentrieren.
16:30
17:00
Time Lecture
10:00 Special Report: High-level programming
Nitin Dahad, Aspencore
Looking at the general trends in industry for programming, model-based design, and even using AI techniques in designing with high-level languages.
10:30 Using Samsung ARTIK to create a smart, connected speaker
Samsung
Voice control & smart speakers are everywhere and we will show you how to use Samsung ARTIK IoT platform to create an integrated smart digital assistant. How does ARTIK make this easier? What are the pitfalls you should be concerned with when designing for wireless? These and more questions answered by Samsung ARTIK IoT platform
11:00 Using Samsung ARTIK IoT platform to enhance your application
Rohit Bhola, Samsung
We’ll show you how you can enhance your application by getting connected and leveraging mobile Apps to remotely configure and control specific IoT products and applications. This dramatically enhances the value of your products by allowing your users to have more control over many features that you integrate.
11:30 Winbond SpiStack Memory for OTA applications
Jackson Huang, Flash Memory Senior Marketing Director
In the days of IoT where systems are connected, regular code update has become the norm. System designers are asked to devise code update strategies which invariably involve updating the firmware stored in flash memories for systems that have been deployed in the field. Such capability has been generalized as OTA. While it strictly means Over-the-Air, it encompasses updates via both wired and wireless methods. This session introduces Winbond’s homogenous SpiStack memories and explains how they can be used to facilitate and simplify the OTA process.
12:00 Arrow Development Tools and Production-ready Solution Platforms
Amir Sherman & Kristof Seja, Arrow Europe
In the last one year Arrow has transformed into a technology platform provider. Nothing shows this better than the wide spectrum of Arrow Development Tools covering various technologies. Whether you are a beginner or an experienced developer you will find the right platform. You can evaluate a wide range wireless technologies including BLE, BLE Mesh, Thread, ZigBee, SigFox, LoRa and NB-IoT just to mention a few.Arrow even took this to the next level. Some Development boards are certified and customizable giving you the ability to go into production with the same platform you used for development.The session will give you an overview on the existing platforms and solutions and shed light on how you can leverage the benefits of Arrow Solutions.
12:30 Mind of The Engineer
Rich Quinnell, Editor, Aspencore Media
Aspencore regularly surveys its worldwide engineering audience, seeking to understand “The Mind of the Engineer.” Questions cover work conditions, job satisfaction, information-gathering methods, and a host of other details to gain insights into how design engineering is being practiced across the globe, and exploring the regional and generational variations. Aspencore Special Projects Editor Rich Quinnell will be presenting the highlights of the 2018 survey results in a 20-minute session open to all Electronica attendees.
13:00 Secure, Flexible and Global integration for IoT devices Making IoT work
Christian Blersch, Inperio Systems GmbH
We give you an overview about secure communication for all IoT devices and show you, how to integrate and manage them in a heterogenous world.
13:30 Development of embedded system in China
Yorbe Zhang, Aspencore
This speech will focus on the market and development trends of embedded system in China, including current situation of embedded computing system, key application breakdown, development language breakdown, as well as embedded software revenue analysis, key Chinese embedded system players, and IoT adoption and application trends.
14:00 Panel Discussion: Addressing new opportunities enabled by 5G
Moderated by Aspencore
The deployment of 5G will not just be at operator level anymore, since it enables many more private networks to be deployed at enterprise and local/regional level. What opportunities does that bring for hardware/software platforms targeted at enterprises looking to implement their own networks?
15:00 Quality and failure analyzes at plug connectors
Dipl. Ing (TU) Holger Krumme, Managing Director-Technical Operations, HTV Halbleiter-Test & Vertriebs-GmbH
Plug connectors play a major role in today's electronics so a high reliability of these components is essential for the whole system's quality. To ensure high quality or analyze failures different methods are available. Those can be non-destructive testing, e.g. X-Ray inspection (2D or 3D), thickness measurements and quantitative composition analysis by X-ray fluorescence spectroscopy (XRF) or measurement of contact resistance as well as destructive test like micro-sectioning for SEM/EDS analysis or space-resolved hardness measurements. Another aspect of quality assurance respectively qualification is the performance of endurance and environmental tests. Some of these methods are shown and illustrated with examples from the real life.
15:30 The edge is getting smarter: AI in the IoT driven by Arrow
Lukasz Grzymkowski, Arrow Europe
With the advent of the Internet of Things, everyone knows that pretty much everything is becoming smarter. From kitchen appliances to cars and infrastructure, the devices are connected and intelligent. While the cost of hardware is dropping, the performance and compute are getting cheaper and more accessible. This holds especially true for the embedded world of IoT.So, if your fridge has more processing power than your laptop, then why shouldn’t it remind you to buy milk on your way home?This talk discusses the shift of AI and Machine Learning from the Cloud-hosted approach to running Machine Learning models on the IoT and edge devices.
16:00 Sustainable success through RFID innovation
Ajank Uhle, ELATEC GmbH
RFID is everywhere in your daily life. But what is this fascinating technology all about and how does it work for your success? We will show you which applications RFID technology can help you to achieve the greatest benefit for your company. In addition, you will learn how to deal with the most diverse standards of transponder technology types worldwide. Explained by various application cases, you will find yourself in at least one of them.
16:30
17:00
Time Lecture
11:00 Special Report: Industry 4.0
Nitin Dahad, Aspencore
With more and more awareness of the benefits of IoT, this report will look at the key players and platforms enabling more connected devices in industrial control systems and infrastructure, plus a special look at the all-important security aspects.
11:30 Safeguarding Your Personal Digital Data with Winbond TrustME Secure Flash
CS Lin, Flash Memory Marketing Executive, Winbond
In the data driven world, the collection of individual’s personal data is increasing, and the manner in which they are stored and processed continues to grow more sophisticated resulting in raising the concerns and challenges of privacy protection. In this session, we will explore common security threats to personal digital data stored in standard flash memory, how Winbond TrustME Secure Flash defends against these security threats and the usage example of Fingerprints protection for Smart Door Lock.
12:00 Mind of The Engineer
Rich Quinnell, Editor, Aspencore Media
Aspencore regularly surveys its worldwide engineering audience, seeking to understand “The Mind of the Engineer.” Questions cover work conditions, job satisfaction, information-gathering methods, and a host of other details to gain insights into how design engineering is being practiced across the globe, and exploring the regional and generational variations. Aspencore Special Projects Editor Rich Quinnell will be presenting the highlights of the 2018 survey results in a 20-minute session open to all Electronica attendees.
12:30 Open Standards for Embedded Computing
Presented by SGET
SGET a technical, scientific and educational not-for-profit association and focuses on open standards for embedded computing. During this session, you will be introduced to and updated about SMARC - a versatile small form factor computer module definition target ing applications that require low power, low costs, and high performance; QSEVEN – this concept is an off-the-shelf, multi vendor, Computer-On-Module that integrates all the core components of a common PC and is mounted onto an application specific carrier board; EMBEDDED NUC™ - specifies a new industrial standard for small form-factor PCs inspired by the Intel® NUC systems (used in consumer products; UNIVERSAL IOT CONNECTOR - consisting of three interface descriptions: hardware, configuration interface and application interface.
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Where to find us?

Our Forum at electronica 2018 is located in Hall A5 - Stand 239.


GET IN TOUCH

AspenCore
Rauwagnerstr. 5
85560 Ebersberg
Germany

Mail: info@iccmedia.com
www.iccmedia.com